基于多层陶瓷技术的宽带60ghz孔径耦合贴片阵列

F. Wollenschlager, R. Stephan, L. Xia, J. Muller, M. Hein
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引用次数: 4

摘要

ISM在60ghz频段提供了足够的带宽,可以实现Gbps范围内的数据无线传输。为了充分利用这一未经许可的频率范围,合适的天线设计必须考虑到频率带宽和天线增益方面的特定应用需求。我们提出了一个成功的实现,基于紧凑的贴片阵列方法,满足现实需求。测量的s参数表明,天线阵列的阻抗带宽为10.5%。测量到的增益达11.8 dBi,在阻抗带宽上的平坦度为2.1 dB。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A broadband 60 GHz aperture-coupled patch array integrated in multilayer ceramics technology
The ISM band at 60 GHz provides sufficient bandwidth for wireless transmission of data rates in the Gbps range. To fully utilize this unlicensed frequency range, the design of suitable antennas has to account for application-specific demands in terms of frequency bandwidth and antenna gain. We present a successful implementation, based on a compact patch array approach, meeting realistic requirements. The measured S-parameters indicate an impedance bandwidth of 10.5% for the antenna array. The measured gain amounts to 11.8 dBi with a flatness of 2.1 dB over the impedance bandwidth.
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