嵌入测试装置的毫米波有源和无源元件的特性

G. Mehdi, Anyong Hu, Z. Cheng, J. Miao, A. Mueed
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引用次数: 1

摘要

毫米波有源和无源元件的性能对与测试夹具相关的不连续非常敏感。为了准确地表征被测设备(DUT)并获得仅被测设备的性能,必须从整体测量中去除夹具的影响。这一过程一般称为去嵌入。在这项工作中,回顾了不同的去嵌入方法,其中两种即透反馈线(TRL)和透线(TL)用于去嵌入工作在Ka波段的边缘耦合带通滤波器(BPF)和低噪声放大器(LNA)。两个dut和TRL套件在介电常数为6.2的衬底上实现。比较了两种方法的测量结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Characterization of Millimeter-Wave Active and Passive Components Embedded in Test Fixtures
The performance of millimeter-wave active and passive components is sensitive to the discontinuities associated with the test fixtures. In order to accurately characterize the device-under-test (DUT) and obtain the DUT only performance, the fixture effects must be removed from the overall measurement. Such process is generally referred to as de-embedding. In this work, different de-embedding methods are reviewed and two of these namely the thru-reflect-line (TRL) and the thru-line (TL) are employed to de-embed an edge-coupled band-pass filter (BPF) and a low noise amplifier (LNA) both operating at Ka band. The two DUTs along with the TRL kit are realized on a substrate with dielectric constant of 6.2. Measured results obtained from the two methods are compared.
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