新型金属环方形微带贴片天线的增益增强

International Conference on Recent Advances and Innovations in Engineering (ICRAIE-2014) Pub Date : 2014-05-09 DOI:10.1109/ICRAIE.2014.6909168

Arvind Kumar, Mithilesh Kumar

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引用次数: 14

摘要

提出了一种利用金属环增强u型槽方形微带贴片增益的方法。所提出的天线设计包括金属贴片周围的金属环，初始距离贴片边缘为自由空间波长的四分之一，金属环的宽度为自由空间波长的十六分之一的三倍。利用CST微波工作室对不带金属环的贴片天线和带金属环的贴片天线进行了仿真比较。提出的微带贴片天线谐振频率为5.8 GHz，适合无线局域网应用。通过这种金属环方法，与传统的微带贴片天线(没有金属环)相比，微带贴片天线的增益提高了约4.3 dB，并且与没有金属环的天线相比，所提出的天线的阻抗带宽也提高了约2%。

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Gain enhancement in a novel square microstrip patch antenna using metallic rings

This paper presents gain enhancement in square microstrip patch with U-slot using metallic rings. The proposed antenna design includes a metallic rings around the metal patch, initially at a distance of the one-quarter of the free space wavelength from the edges of patch and width of metallic ring is three times of one-sixteen of the free space wavelength. Using CST Microwave studio, the results of the patch antenna without metallic rings and patch surrounded by metallic rings are simulated and compared. The proposed microstrip patch antenna resonates at the 5.8 GHz frequency suitable for wireless local area network applications. By this metallic rings approach there is enhancement in the gain of microstrip patch antenna about 4.3 dB as compared to conventional one (without metallic rings) and also about 2 percent improvement in impedance bandwidth of proposed antenna as compare to antenna without metallic ring.

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来源期刊

International Conference on Recent Advances and Innovations in Engineering (ICRAIE-2014)

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