移动设备中天线- pcb耦合的快速评估:一种宏建模方法

S. Grivet-Talocia, M. Bandinu, F. Canavero, I. Kelander, P. Kotiranta
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引用次数: 11

摘要

本文提出了一种快速评估移动设备上天线与印刷电路板(PCB)走线之间电磁耦合的方法。从器件的几何描述开始,使用单波模拟来计算选定PCB位置的电场。然后,利用场激励传输线理论计算了任意布线的PCB走线末端天线诱导的电磁干扰耦合系数。最后将结果反馈给合理的拟合算法,用于生成宽带spice兼容的网表。该网络表可用于基于系统级电路的信号完整性评估仿真,包括天线诱导的电磁干扰。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fast Assessment of Antenna-PCB Coupling in Mobile Devices: a Macromodeling Approach
This paper presents a fast procedure for the evaluation of electromagnetic coupling between antennas and Printed Circuit Board (PCB) traces on mobile devices. Starting from the geometrical description of the device, a single full-wave simulation is used to compute the electric fields at selected PCB locations. Then, the theory of field-excited transmission lines is used to compute the antenna-induced EMI coupling coefficients at the terminations of an arbitrarily routed PCB trace. The results are finally fed to a rational fitting algorithm for the generation of a broadband SPICE-compatible netlist. This netlist can be used in system-level circuit-based simulations for signal integrity assessments including antenna-induced EMI.
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