活性氢气氛下无焊剂焊接

2020 International Wafer Level Packaging Conference (IWLPC) Pub Date : 2020-10-13 DOI:10.23919/IWLPC52010.2020.9375859

Gregory K. Arslanian, C. Christine Dong, R. E. Patrick, Bruce Xiang, K. Wathne

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引用次数: 0

摘要

提出了一种基于活化氢或电子附着(EA)的新型氢活化技术，用于常温常压无焊剂焊接。该技术有潜力用于电子封装行业的一系列应用，最近由空气产品公司和西卡玛国际公司共同努力，对基于电子附着(EA)的无熔剂晶圆碰撞回流的生产规模炉进行了alpha试验。

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Fluxless Soldering in Activated Hydrogen Atmosphere

A novel hydrogen activation technology based on activated hydrogen or electron attachment (EA) is developed for fluxless soldering at ambient pressure and normal soldering temperature. The technology has a potential to be used for a list of applications in the electronics packaging industry and recent work by a joint effort between Air Products and Sikama International on alpha trials of a production-scale furnace for flux-free wafer bump reflow based on electron attachment (EA).

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来源期刊

2020 International Wafer Level Packaging Conference (IWLPC)

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