激光形成的MakeLink*定制和维修

2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203) Pub Date : 2001-10-08 DOI:10.1109/ISSM.2001.962985

J. Bernstein, Joohan Lee

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引用次数: 0

摘要

介绍了在两个标准金属化层之间垂直形成的新型激光可编程互连元件(MakeLink/sup TM/)的一些应用。在最佳激光能量下，最小链路的平均电阻小于10/spl ω /。加速直流电流密度和温度下的寿命试验表明，电迁移可靠性高。基于商用激光系统，该技术可扩展至1.5 /spl mu/m间距。对各种结构的有限元模型进行了仿真，结果表明，对于任意缩放的环节都存在可接受的过程窗口。标准CMOS工艺兼容性，无编程电路，高电流处理能力，密封性和辐射硬度等特性使其在可定制设备中非常有用，并取代激光熔断器，用于提高产量和其他快速定制应用。

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A laser formed MakeLink* for customization and repair

Some applications are presented for implementing a novel laser-programmable interconnect element (MakeLink/sup TM/) formed vertically between two standard metallization layers. The average electrical resistance for the smallest link is less than 10/spl Omega/ at optimal laser energy. Life tests under accelerating DC current densities and temperatures indicated high electromigration reliability. This technology is shown to be scaleable down to 1.5 /spl mu/m pitch based on commercially available laser systems. Finite element models of various structures were simulated and the results show that there exists an acceptable process window for any scaled link. Properties such as standard CMOS process compatibility, no programming circuit, high current handling capability, hermeticity and radiation hardness, make it useful in customizable devices and to replace laser fuses for yield enhancement and other rapid customization applications.

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来源期刊

2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)

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