2001年300毫米晶圆制造商的投影

Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium Pub Date : 1996-10-14 DOI:10.1109/IEMT.1996.559709

S. Balaji, J.A. Shapiro, K. Gardiner

{"title":"2001年300毫米晶圆制造商的投影","authors":"S. Balaji, J.A. Shapiro, K. Gardiner","doi":"10.1109/IEMT.1996.559709","DOIUrl":null,"url":null,"abstract":"This paper summarizes the work of nineteen students in a graduate class offered during the Winter/Spring semester of 1996 in an MS in Manufacturing Systems Engineering program. There is an assessment of the manufacturing technologies and tooling needed for the realization of an advanced microprocessor-like product in 2001. A representative 'typical' process routing was developed by examining leading-edge products and current projections. The fab will process 300 mm wafers and ship naked die. There are estimates of capital costs, and potential production volumes, these are somewhat scalable and afford a method for benchmarking and gauging future trends in this industry.","PeriodicalId":177653,"journal":{"name":"Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A projection for a 300 mm wafer fabricator in 2001\",\"authors\":\"S. Balaji, J.A. Shapiro, K. Gardiner\",\"doi\":\"10.1109/IEMT.1996.559709\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper summarizes the work of nineteen students in a graduate class offered during the Winter/Spring semester of 1996 in an MS in Manufacturing Systems Engineering program. There is an assessment of the manufacturing technologies and tooling needed for the realization of an advanced microprocessor-like product in 2001. A representative 'typical' process routing was developed by examining leading-edge products and current projections. The fab will process 300 mm wafers and ship naked die. There are estimates of capital costs, and potential production volumes, these are somewhat scalable and afford a method for benchmarking and gauging future trends in this industry.\",\"PeriodicalId\":177653,\"journal\":{\"name\":\"Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium\",\"volume\":\"29 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-10-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.1996.559709\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1996.559709","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

本文总结了1996年冬季/春季学期19名制造系统工程硕士研究生班学生的工作。对2001年实现先进微处理器产品所需的制造技术和工具进行了评估。通过检查前沿产品和当前预测，开发了具有代表性的“典型”工艺路线。该晶圆厂将加工300毫米晶圆并运送裸晶圆。对资本成本和潜在产量的估计，这些都是可扩展的，并提供了一种基准测试和衡量该行业未来趋势的方法。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A projection for a 300 mm wafer fabricator in 2001

This paper summarizes the work of nineteen students in a graduate class offered during the Winter/Spring semester of 1996 in an MS in Manufacturing Systems Engineering program. There is an assessment of the manufacturing technologies and tooling needed for the realization of an advanced microprocessor-like product in 2001. A representative 'typical' process routing was developed by examining leading-edge products and current projections. The fab will process 300 mm wafers and ship naked die. There are estimates of capital costs, and potential production volumes, these are somewhat scalable and afford a method for benchmarking and gauging future trends in this industry.

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Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium

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