Compressive Sensing Detection of RF Signals by All-Optically Generated Binary Random Patterns

Co-packaging is a promising solution to support high-density high-speed signal transmission for the next generation very wide bandwidth network switches. We have demonstrated solderable VCSEL-based parallel optical modules which can minimize the foot print because it does not require any electrical pluggable interface. The optical module has been adopted to 100-Gb/s QSFP28 in commercialization. Here, we study how the optical modules can support network switches on the co-packaging architecture. Based on an assumption to simplify the co-packaging structure, we study the relationship between the width of optical module, the distance between optical module and switch ASIC, the length of substrate. As discussed, a data rate per channel should be 100 Gb/s or higher. A small 1.6-Tb/s or 3.2 Tb/s optical module might be suitable for a 51.2-Tb/s network switch.