温度对热载子诱导pmosfet降解的影响

Shuang-Yuan Chen, C. Tu, Jung-Chun Lin, Po-Wei Kao, Wen-Cheng Lin, Z. Jhou, S. Chou, J. Ko, H. Haung
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引用次数: 6

摘要

在不同应力模式和温度下对两种pmosfet施加低电压,研究热载子(HC)诱导的降解。与传统概念相反,本研究表明pMOSFET HC可靠性的最差条件涉及CHC模式和高温。pmosfet的退化严重程度已经可以与nMOSFET相媲美。提出了一种可能的损伤机制,包括HC和负偏温效应(NBTI)的积分产生界面态。提出了一种新的基于外加电压和温度的经验寿命模型
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Temperature Effects on the Hot-Carrier Induced Degradation of pMOSFETs
Low voltages in various stress modes and temperatures were applied on two kinds of pMOSFETs to investigate the hot-carrier (HC) induced degradation. Contrary to conventional concepts, this investigation demonstrates that the worst conditions for pMOSFET HC reliability involves CHC mode and at high temperature. The severity of degradation of pMOSFETs has become comparable to their nMOSFET counterparts. A probable damage mechanism is suggested to involve the generation of interface states by the integration of HC and negative biased temperature effect (NBTI). A new empirical lifetime model is proposed in terms of applied voltages and temperatures
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