新一代3D NAND的问题与关键技术

2021 International Conference on Electronics, Information, and Communication (ICEIC) Pub Date : 2021-01-31 DOI:10.1109/ICEIC51217.2021.9369795

Chiweon Yoon, Hyunggon Kim, Seon-Kyoo Lee, Jin-Yup Lee, J. Song

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引用次数: 2

摘要

本文介绍了未来3D NAND的设计挑战和克服障碍的关键技术。更具体地说，详细介绍了高密度，低成本和高带宽NAND的最新解决方案。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Issues and Key Technologies for Next Generation 3D NAND

In this paper, design challenges and key technologies to overcome the hurdles for the future 3D NAND are introduced. More specifically, state-of-the-art solutions for higher density, lower cost and higher bandwidth NAND is covered in detail.

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来源期刊

2021 International Conference on Electronics, Information, and Communication (ICEIC)

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