为微芯片应用提供更可靠、更精确的快速积分方程求解器

W. Chew, L.J. Jiang, Y. Chu, G.L. Wang, Y.C. Pan
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引用次数: 10

摘要

只提供摘要形式。在这次演讲中,我们回顾了低频和高频的快速积分方程求解器。我们讨论了当前的一些问题,并提出了可能的解决方案。我们还描述了分层介质的快速求解器的使用。当应用于低频时,快速求解器通常有低频击穿。讨论了克服这种低频击穿的方法。此外,一般矩量法遇到低频击穿问题,并给出了解决方法。许多低频问题可以通过将频率设置为零来解决,从而解决静电或静磁问题。提出了一种求解技术。对于分层结构,我们需要一个特殊的格林函数。封闭形式的格林函数可用于解决一些复杂的分层介质问题。此外,还展示了快速求解器在光刻问题中的一些应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Toward a more robust and accurate fast integral equation solver for microchip applications
Summary form only given. In this talk, we review fast integral equation solvers for low frequencies and high frequencies. We discuss some of the current problems and suggest possible solutions. We also describe the use of fast solvers for layered media. When applied to low frequencies, fast solvers usually have a low-frequency breakdown. Methods to overcome this low frequency breakdown are discussed. Moreover, a general method of moments encounters low frequency breakdown problems, and a remedy for this is also given. Many of the low frequency problems can be tackled by setting the frequency identically to zero, hence solving an electrostatic or a magnetostatic problem. Such a solution technique is also presented. For layered structures, we need a special Green's function. A closed form Green's function can be used to solve some of the complicated layered medium problems. Also, some applications of fast solvers to solve the lithography problem are demonstrated.
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