通过在注塑和瓦楞包装产品中使用新的热塑性化合物来控制ESD和清洁度

Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476) Pub Date : 2000-09-26 DOI:10.1109/EOSESD.2000.890037

M. Narkis, G. Lidor, A. Vaxman, L. Zuri

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引用次数: 0

摘要

基于炭黑在多组分体系中的选择性定位，最近开发出了用于注射成型和瓦楞包装的新型静态耗散热塑性材料。本文分析了这些新化合物在理想的静态耗散范围内(10/sup 6/-10/sup 9/ /spl Omega//sq)具有一致电阻率的洁净室相容性，并实现了极低的炭黑负载(小于2 wt%)。目的是了解各种材料在ESD和清洁度方面的性能。离子污染，除气，非挥发性残留物和电学性质是主要的主题。

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Controlling ESD and cleanliness by using new thermoplastic compounds for injection molded and corrugated packaging products

New static dissipative thermoplastic materials for injection molding and corrugated packaging have been recently developed based on the selective localization of carbon black in a multi-component system. This paper analyses the cleanroom compatibility of these new compounds with consistent resistivities within the desired static dissipative range (10/sup 6/-10/sup 9/ /spl Omega//sq) achieved with very low carbon black loadings (less than 2 wt%). The goals were to obtain an understanding of the various materials' performance with regards to ESD and cleanliness. Ionic contamination, outgassing, nonvolatile residues and electrical properties are the main topics addressed.

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Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476)

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