具有倒锥结构的透镜光纤和硅纳米线波导之间的无环氧树脂对接耦合

8th IEEE International Conference on Group IV Photonics Pub Date : 2011-11-01 DOI:10.1109/GROUP4.2011.6053825

H. Porte, B. Ben Bakir, S. Bernabé

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引用次数: 1

摘要

我们报告了一种以v型槽和微加工缺口相结合为特征的硅底座的设计和实现，允许在无环氧树脂配置中承载透镜光纤。在基板和波导芯片之间的相同的热系数允许得到一个低的温度依赖。

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Epoxy free butt coupling between a lensed fiber and a silicon nanowire waveguide with an inverted taper configuration

We report the design and realization of a silicon submount characterized by the association of V-groove and a micromachined notch, allowing to host a lensed fiber in an epoxy free configuration. The identical thermal coefficient between the submount and the waveguide chip allows to get a low temperature dependence.

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8th IEEE International Conference on Group IV Photonics

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