Rigorous electromagnetic modeling of chip-to-package (first-level) interconnections

A methodology is presented for the rigorous electromagnetic analysis of pulse transmission through first-level interconnects. The methodology combines a full-wave, vectorial, time-dependent Maxwell's equations solver with SPICE circuit models for the nonlinear drivers, to facilitate the accurate modeling of the electromagnetic phenomena occurring at the chip-to-package interface. Comparisons of the results obtained using this method with others calculated using SPICE simulations are used to validate the method and demonstrate its application in the electromagnetic modeling of high-speed packaging structures.<>