300mm晶圆厂架构对比分析设备组对晶圆成本和动态性能的影响

2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203) Pub Date : 2001-10-08 DOI:10.1109/ISSM.2001.962992

R. Bachrach, M. Pool, K. Genovese, J.C. Moran, M. O'Halloran, T. J. Connolly

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引用次数: 0

摘要

半导体制造商是一个高度复杂的系统，它拥有能够根据其工艺流程制造IC产品器件的工艺工具。0.15 /spl mu/m逻辑流程的典型流程由300至400个步骤组成，其中包含22至24个掩码步骤。对于任何工艺流程，都可能有各种各样的设备集和组织架构。本报告介绍了两种300mm FAB架构的比较分析结果。设备组对晶圆厂尺寸、成本和性能的影响被描述为运行特性的函数。

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Comparative analysis of 300 mm FAB architectures impact of equipment sets on wafer cost and dynamic performance

A semiconductor fabricator is a highly complex system that hosts the process tools capable of manufacturing IC product devices based upon their process flows. A typical process flow for a 0.15 /spl mu/m logic process consists of 300 to 400 steps with 22 to 24 mask steps. A variety of equipment sets and organizational architectures are possible for any process flow. The results of a comparative analysis of two such 300 mm FAB architectures are presented in this report. The impact of equipment sets on fab Sizing, Cost, and Performance are described as a function of operating characteristics.

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2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)

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