S波段和x波段雷达发射/接收模块概述

2007 IEEE Radar Conference Pub Date : 2007-04-17 DOI:10.1109/RADAR.2007.374347

B. Kopp

{"title":"S波段和x波段雷达发射/接收模块概述","authors":"B. Kopp","doi":"10.1109/RADAR.2007.374347","DOIUrl":null,"url":null,"abstract":"This paper will discuss pertinent issues and trends for S-band and X-band transmit/receive (T/R) modules. The performance of gallium arsenide (GaAs) T/R module components and wide bandgap power amplifiers will be presented along with future challenges. T/R module cost will also be addressed with an emphasis on semiconductor cost factors and issues. Finally, a discussion of packaging and assembly technologies will be provided.","PeriodicalId":367078,"journal":{"name":"2007 IEEE Radar Conference","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"S- and X-Band Radar Transmit/Receive Module Overview\",\"authors\":\"B. Kopp\",\"doi\":\"10.1109/RADAR.2007.374347\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper will discuss pertinent issues and trends for S-band and X-band transmit/receive (T/R) modules. The performance of gallium arsenide (GaAs) T/R module components and wide bandgap power amplifiers will be presented along with future challenges. T/R module cost will also be addressed with an emphasis on semiconductor cost factors and issues. Finally, a discussion of packaging and assembly technologies will be provided.\",\"PeriodicalId\":367078,\"journal\":{\"name\":\"2007 IEEE Radar Conference\",\"volume\":\"34 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-04-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 IEEE Radar Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RADAR.2007.374347\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE Radar Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RADAR.2007.374347","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 9

摘要

本文将讨论s波段和x波段收发模块的相关问题和发展趋势。砷化镓(GaAs) T/R模块组件和宽带隙功率放大器的性能将与未来的挑战一起提出。T/R模组成本也将着重于半导体成本因素和问题。最后，将讨论封装和组装技术。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

S- and X-Band Radar Transmit/Receive Module Overview

This paper will discuss pertinent issues and trends for S-band and X-band transmit/receive (T/R) modules. The performance of gallium arsenide (GaAs) T/R module components and wide bandgap power amplifiers will be presented along with future challenges. T/R module cost will also be addressed with an emphasis on semiconductor cost factors and issues. Finally, a discussion of packaging and assembly technologies will be provided.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2007 IEEE Radar Conference

自引率

0.00%

发文量