集成电路成型过程中的线材扫描

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI:10.1109/ECTC.1990.122278

L. Nguyen, F. J. Lim

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引用次数: 32

摘要

研究了在塑料包装的传递成型过程中导致钢丝扫线的条件。所研究的参数包括材料流动特性、模腔/引线框架长径比、线材模量和线材粘结配置(例如直径、长度和方向)。为了量化扫描条件，使用透明硅流体进行了流动可视化，并使用环氧化合物进行了实际成型。一个14引线双极装置连接在一个嵌入式铜引线框架上，并与金线结合在一起，是测试工具。给出了线材扫描性能与各种加工参数之间的函数关系。

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Wire sweep during molding of integrated circuits

The conditions that lead to wire sweep during transfer molding of plastic packages are examined. The parameters investigated include the material flow properties, the mold cavity/leadframe aspect ratio, the wire modulus, and the wire bond configuration (e.g. diameter, length, and orientation). Flow visualization with a clear silicone fluid and actual molding with an epoxy compound were carried out in order to quantify sweep conditions. A 14-lead bipolar device attached to a recessed copper leadframe and bonded with gold wires was the test vehicle. A functional relationship between the wire sweep behavior and the various processing parameters is presented.<>

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来源期刊

40th Conference Proceedings on Electronic Components and Technology

CiteScore

3.10

自引率

0.00%

发文量