用于60GHz前端模块的硅集成介质谐振器天线解决方案

J. P. Guzman, C. Calvez, R. Pilard, F. Gianesello, M. Ney, D. Gloria, C. Person
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引用次数: 12

摘要

提出了一种用于60GHz无线前端完全集成的新型介质谐振器天线(DRA)解决方案。该解决方案是一种SoC配置,由集成PA和CPW馈电槽组成,采用意法半导体的65nm CMOS SOI(绝缘体上硅)技术。考虑了协同设计策略,以减小系统的尺寸和匹配电路的损耗。放大器和天线激励元件的总尺寸均为1mm2。然后将天线元件作为一个整体从该SoC解决方案中提取到SiP配置中,该配置可以集成DR和硅基元件,在指定频段内实现高增益(5dBi)和5GHz带宽。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Silicon integrated dielectric resonator antenna solution for 60GHz front-end modules
A new dielectric resonator antenna (DRA) solution for the complete integration of radio front end at 60GHz is presented. The solution is a SoC configuration consisting of an integrated PA and a CPW fed slot on 65nm CMOS SOI (Silicon on Insulator) technology from ST Microelectronics. A co-design strategy is taken into consideration to reduce the size of the system and matching circuit losses. A total size of 1mm2 die has been achieved for both PA and Antenna excitation element. The antenna element as a whole is then taken from this SoC solution into a SiP configuration which can integrate the DR and silicon based elements, achieving a high gain (5dBi) and a bandwidth of 5GHz in the specified band.
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