G. Arndt, C. Dupré, J. Arcamone, G. Cibrario, O. Rozeau, L. Duraffourg, E. Ollier, É. Colinet
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引用次数: 12
摘要
本文首次在单芯片上实现了完全协集成的单晶NEMS谐振器及其CMOS电子器件。该CMOS技术基于“国产”0.3μm全耗尽(FD) SOI技术。在自上而下的前端VLSI工艺中,由SOI硅层制造的谐振器由静电力驱动。用两个掺磷硅压阻(PZR)计来检测振动的差异。有关NEMS-FD SOI CMOS工艺流程的详细信息也可以在[3]中找到,而本文主要报道了电路的设计及其首次电气测量。
Towards ultra-dense arrays of VHF NEMS with FDSOI-CMOS active pixels for sensing applications
This paper presents the first realization of a fully co-integrated single-crystal NEMS resonator and its CMOS electronics on a single chip. The CMOS technol ogy is based on a "home-made" 0.3μm fully depleted (FD) SOI technology. The resonator fabricated from the SOI silicon layer in a top-down front-end VLSI process is actuated thanks to electrostatic forces. The vibrations are detected differentially with two p-doped silicon piezoresistive (PZR) gauges. Details concerning the NEMS-FD SOI CMOS technological process can also be found in [3] while this paper primarily reports on the design of the circuitry and its first electrical measurements.