各种线材及触点焊盘的焊线拉拔/剪切力分析

Reviews on Advanced Materials and Technologies Pub Date : 1900-01-01 DOI:10.17586/2687-0568-2022-4-3-52-55

A. Kamarchuk, K.R. Razzhivina, A. I. Marchenko, D. Bauman

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引用次数: 0

摘要

本文研究了不同材料(银、金、铜)的导线触点，以及不同镀层(浸金、原生金、原生银)触点垫上的微焊接方法。给出了粘接拉拔/剪切力测试结果，并比较了各种触点工艺操作的结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Analysis of Wire Bonding Pull-off/Shear Force for Various Wire Materials and Contact Pads

In this paper we study wire contacts made of varied materials (Ag, Au, Cu) and microwelding methods at contact pads with different coatings — immersion gold, galvanic gold, galvanic silver. We present the results of bonding pull-off/shear force testing and compare results of various wire contacts technological operation.

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Reviews on Advanced Materials and Technologies

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