FR-4层压板上的毫米波共面互连和散热器

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2012-10-01 DOI:10.1109/EPEPS.2012.6457912

S. Aroor, R. Pierce, R. Henderson, A. Blanchard

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引用次数: 3

摘要

本文演示了使用阻燃4 (FR-4)层压板在毫米波频率下用于封装天线(AiP)解决方案的共面波导(CPW)互连和散热器。在两种类型的FR-4层压板上制作了CPW传输线和带CPW馈电的宽带天线，以详细说明该材料的性能。测量结果显示，在60 GHz时的平均衰减为0.19 dB/mm，与其他封装基板在毫米波长下的衰减相当。在60 GHz到90 GHz范围内，cpw馈电领结孔径的回波损耗低于10 dB。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Millimeter-wave coplanar interconnects and radiators on FR-4 laminates

This paper demonstrates coplanar waveguide (CPW) interconnects and radiators for antenna-in-package (AiP) solutions at millimeter-wave frequencies using flame-resistant 4 (FR-4) laminates. CPW transmission lines and broadband antennas with CPW feeds have been fabricated on two types of FR-4 laminates to detail the performance of this material. Measurements show an average attenuation of 0.19 dB/mm at 60 GHz, which is comparable to that of other packaging substrates at millimeter wavelengths. CPW-fed bow-tie apertures have a return loss below 10 dB from 60 GHz to 90 GHz.

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2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems

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