无铅焊接工艺能耗评价

M. Fujino, T. Suga
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引用次数: 2

摘要

现在电子工业是由于用无铅焊料代替传统焊料。替代含铅焊料可以降低焊料的铅毒性,但根据生命周期分析(LCA),可能会造成焊接过程中能耗的增加。我们调查了各公司生产现场的焊接工艺能耗,并比较了使用传统焊料和使用无铅焊料的安装工艺能耗值。结果表明,替代无铅焊料所引起的能耗增长率低于LCA计算结果。因此,焊接过程的能耗可以保持现状。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Evaluation of energy consumption of lead-free soldering process
Now the electronics industry is due to substitute lead-free solder for conventional solder. Substitution of lead-bearing solders can bring out reduction of the toxicity of solders caused by lead, but according to Life Cycle Analysis (LCA), it may cause increase of energy consumption in the soldering process. We investigated the energy consumption of the soldering process at production sites of various companies and compared the values of the energy consumption of mounting process using conventional solder with that using lead-free solder. In results, the increase rate of the energy consumption caused by the substitution of lead-free solder is lower than that calculated by LCA. Therefore the energy consumption of soldering process can hold the status quo.
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