VI短路中断后后期击穿的性质

H. Schellekens, S. Olive, K. P. Huy, P. Ndiaye, C. Pasqualini
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引用次数: 2

摘要

用三种方法研究了真空断路器短路断流后的后期击穿。1. 对接触面和电极间空间进行高速摄影,以便将重击的位置与接触面上的普遍条件相关联;电弧和重击过程中的光谱分析,以评估电离粒子密度和电子密度;和3。在TRV阶段计算液滴轨迹的双成像系统。我们发现95%的重击与电流为零时电极间隙中的氢和接触面边缘的热点有关。我们认为击穿是混合帕申型:部分击穿在热点周围高密度的金属蒸气中,由热电子发射点燃,部分击穿在灭弧过程中积聚的氢气中。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Nature of late breakdowns in VI's after short circuit interruption
Late breakdowns in vacuum interrupters after short circuit current interruption are studied with three methods. 1. High speed photography of the contact surface and the inter-electrode space to correlate the position of the restrike with respect to the prevailing conditions on the contact surface : 2. Spectrography during arcing and restrike to evaluate ionized particle densities and electron density ; and 3. A double imaging system to calculate the trajectories of droplets during the TRV phase. We found 95% of the restrikes to be associated with hydrogen in the inter-electrode gap at current zero, and remaining hot spots on the edge of the contact surface. We conclude the breakdown to be of a mixed Paschen type: partially in metal vapour of high density around hot spots and ignited by thermal electron emission, and partially in hydrogen gas which accumulates during arcing in the interrupter.
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