用于恶劣环境的谐振无线压力传感系统的ASIC,使用基于q的温度补偿,在- 40至150°C之间实现±2%的误差

M. Rocznik, F. Henrici, Remigius Has
{"title":"用于恶劣环境的谐振无线压力传感系统的ASIC,使用基于q的温度补偿,在- 40至150°C之间实现±2%的误差","authors":"M. Rocznik, F. Henrici, Remigius Has","doi":"10.1109/ISSCC.2012.6176975","DOIUrl":null,"url":null,"abstract":"Pressure sensors used in automotive applications are subject to increasingly harsh environments such as acid containing gases in vehicle exhausts or exhaust gas recirculation. State-of-the-art gel protection for sensing elements and their electronics is reaching its limit. A circuit's exposed aluminum bond pads are especially vulnerable to corrosion and failure. In response to these issues, we report an approach to eliminate bond pads and bonds between the sensor and IC altogether.","PeriodicalId":255282,"journal":{"name":"2012 IEEE International Solid-State Circuits Conference","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":"{\"title\":\"ASIC for a resonant wireless pressure-sensing system for harsh environments achieving ±2% error between −40 and 150°C using Q-based temperature compensation\",\"authors\":\"M. Rocznik, F. Henrici, Remigius Has\",\"doi\":\"10.1109/ISSCC.2012.6176975\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Pressure sensors used in automotive applications are subject to increasingly harsh environments such as acid containing gases in vehicle exhausts or exhaust gas recirculation. State-of-the-art gel protection for sensing elements and their electronics is reaching its limit. A circuit's exposed aluminum bond pads are especially vulnerable to corrosion and failure. In response to these issues, we report an approach to eliminate bond pads and bonds between the sensor and IC altogether.\",\"PeriodicalId\":255282,\"journal\":{\"name\":\"2012 IEEE International Solid-State Circuits Conference\",\"volume\":\"30 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-04-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"14\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE International Solid-State Circuits Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSCC.2012.6176975\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE International Solid-State Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.2012.6176975","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 14

摘要

用于汽车应用的压力传感器受到越来越恶劣的环境的影响,例如车辆废气中含有酸性气体或废气再循环。用于传感元件及其电子器件的最先进的凝胶保护已达到极限。电路裸露的铝键垫特别容易受到腐蚀和损坏。针对这些问题,我们报告了一种完全消除传感器和IC之间键合垫和键合的方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
ASIC for a resonant wireless pressure-sensing system for harsh environments achieving ±2% error between −40 and 150°C using Q-based temperature compensation
Pressure sensors used in automotive applications are subject to increasingly harsh environments such as acid containing gases in vehicle exhausts or exhaust gas recirculation. State-of-the-art gel protection for sensing elements and their electronics is reaching its limit. A circuit's exposed aluminum bond pads are especially vulnerable to corrosion and failure. In response to these issues, we report an approach to eliminate bond pads and bonds between the sensor and IC altogether.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信