半导体制造中的软件:近况与前景(会议报告)

Y. Granik
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引用次数: 0

摘要

我们探讨了软件建模在半导体制造中的作用,并将其与建模在人类活动的其他领域中所扮演的角色进行了对比。讨论了物理和紧凑过程建模的主要趋势和挑战。我们考虑由于其多维性而产生的复杂性。综述了光学近距离校正技术及其在卫星上的应用现状。在处理复杂系统和参数交互时,收集了一些有指导意义的例子来证明我们的直觉的缺点。我们思考新的有前途的技术和前景应用的科学和商业机会。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Software in semiconductor manufacturing: peripeteias and prospects (Conference Presentation)
We explore role of software modeling in semiconductor manufacturing and contrast it with the roles that modeling plays in other fields of human activity. Major trends and challenges in physical and compact process modeling are discussed. We contemplate complexities arising from their multi-dimensional nature. The landscape of Optical Proximity Correction and satellite applications is surveyed. Instructive examples are collected that demonstrate shortcomings of our intuition while dealing with complex systems and parameter interactions. We ponder over the scientific and business opportunities of new promising techniques and prospective applications.
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