石墨烯合成中Cu衬底制备技术的研究进展

Siddarth Laveti, T. Manna, Jodi Grzeskowiak, M. Strohmayer, C. Ventrice
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引用次数: 0

摘要

制备大面积石墨烯薄膜的最常用技术是在铜箔衬底上进行化学气相沉积。铜被用作底物,因为在化学气相沉积进行的温度下,碳在铜中的溶解度非常低。这确保了表面介导的生长,如果使用低前驱体压力,则可以自我限制为单层石墨烯。在进行化学气相沉积之前,需要去除未加工箔上的表面氧化物和碳,以实现均匀的石墨烯生长。此外,应该降低铜箔表面的粗糙度,以帮助防止石墨烯薄膜在生长过程中形成缺陷。本研究项目的目标是确定制备铜箔衬底以生产高质量石墨烯的最佳工艺。实验用纯度分别为99.8%和99.999%的铜箔。Cu衬底的制备过程包括在850℃下1 × 10−5 Torr的H2中退火,以去除天然氧化物并降低表面粗糙度。然后在500°C下,在1 × 10−6 Torr的O2中退火,将碳从箔表面转化为CO2和CO。在此温度下,氧在Cu中的溶解度可以忽略不计,从而防止氧溶解到体中。氧退火后,在850℃下以1 × 10−5 Torr的H2进行退火,以去除Cu表面在O2中退火过程中形成的化学吸附氧。在这项研究中,退火时间是不同的,以确定最佳的技术,为每个箔纯度的石墨烯合成。采用x射线光电子能谱、扫描电镜和光学显微镜对样品进行了表征。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Development of Cu Substrate Preparation Techniques for Graphene Synthesis
The most common technique for producing large area graphene films is by chemical vapor deposition on Cu foil substrates. Cu is used as a substrate because the solubility of carbon in Cu at the temperatures at which the chemical vapor deposition is performed is very low. This ensures a surface-mediated growth that is self-limited to a single monolayer of graphene if low precursor pressures are used. Before performing chemical vapor deposition, the surface oxide and carbon that is on the unprocessed foil need to be removed to achieve uniform graphene growth. In addition, the roughness of the surface of the Cu foil should be reduced to help prevent defects from forming in the graphene film during growth. The goal of this research project is to determine the optimal procedure for preparation of the Cu foil substrate to produce high quality graphene. Cu foils with 99.8% and 99.999% purity were used for the experiment. The Cu substrate preparation procedure involves annealing in 1 × 10−5 Torr of H2 at 850 °C to remove the native oxide and to reduce surface roughness. This is followed by annealing in 1 × 10−6 Torr of O2 at 500 °C to remove carbon from the surface of the foil by conversion to CO2 and CO. At this temperature, the solubility of oxygen in Cu is negligible, thus preventing dissolution of oxygen into the bulk. After the oxygen anneal, the foil is annealed in 1 × 10−5 Torr of H2 at 850 °C to remove chemisorbed oxygen from the Cu surface that has formed during the anneal in O2. The anneal durations in this study were varied to determine the optimal technique for graphene synthesis for each foil purity. The samples were characterized using X-ray photoelectron spectroscopy, scanning electron microscopy, and optical microscopy.
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