使用温度变化的电沉积方法形成合成物

Assita Wahyu Andiani, Esmar Budi, I. Sugihartono
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引用次数: 2

摘要

对Ni-TiAlN/Si3N4复合膜的涂层工艺进行了研究,研究了不同温度对Ni-TiAlN/Si3N4复合膜表面形貌的影响。以6 g/L AlN、6 g/L TiN、40 g/L H3BO3、0.6 g/L Si3N4、0.17 M NiCl2.6H2O、0.38 M NiSO4.6H2O和0、6 g/L十二烷基硫酸钠为电解液,以5 mA电流在碳化钨衬底上电沉积15分钟。温度变化为35℃、40℃和45℃,通过扫描电镜(SEM)对复合膜的形貌进行了表征。结果表明:随着温度的升高,Ni-TiAlN/Si3N4复合膜形貌越来越不均匀,晶粒形状粗糙,不均匀;
本文章由计算机程序翻译,如有差异,请以英文原文为准。
PEMBENTUKAN LAPISAN KOMPOSIT Ni- TiAlN/Si3N4 MENGGUNAKAN METODE ELEKTRODEPOSISI DENGAN VARIASI TEMPERATUR
Research was conducted on coating process of the Ni-TiAlN/Si3N4 composite film to study the effect of various temperature on the surface morphology of the Ni-TiAlN/Si3N4 composite film. The coating process was conducted by electrodeposition method with a 5 mA of current for 15 minutes on tungsten carbide substrate with electrolyte solution that consists of 6 g/L AlN, 6 g/L TiN, 40 g/L H3BO3, 0.6 g/L Si3N4, 0.17 M NiCl2.6H2O, 0.38 M NiSO4.6H2O dan 0,6 g/L Sodium Dodecyl Sulfate. Variations temperature is 35°C, 40°C and 45°C The composite film morphology was characterized by Scanning Electron Microscopy (SEM). The results showed that as temperature increased, the Ni-TiAlN/Si3N4 composite film morphology was formed increasingly uneven, has coarser grain shape and not homogenous.
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