一个完全集成的CAD基础设施，用于设计、优化和虚拟制造离散和可集成功率半导体器件和电路

Proceedings of 1994 IEEE Workshop on Computers in Power Electronics Pub Date : 1994-08-07 DOI:10.1109/CIPE.1994.396742

K. Shenai

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引用次数: 1

摘要

本文提出了一种适用于功率半导体开发和制造的虚拟晶圆制造基础架构。在该框架中，将先进的2d过程和器件模拟器连接在一起。混合模式电路仿真是在实际电路应用环境中对半导体器件载流子动力学进行优化的方法。电路仿真的结果用于通过仔细权衡工艺、器件、电路性能和可靠性参数，为给定应用开发最佳器件。该方法的应用通过谐振功率变换器中igbt的设计和优化来说明。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A fully-integrated CAD infrastructure for the design, optimization and virtual manufacturing of discrete and integrable power semiconductor devices and circuits

This paper presents a virtual wafer fabrication infrastructure suitable for power semiconductor development and manufacturing. In the framework, advanced 2D-process and device simulators are interfaced. Mixed-mode circuit simulation is used in which semiconductor device carrier dynamics are optimized in an actual circuit application environment. The results of the circuit simulation are used to develop an optimum device for a given application by carefully trading the process, device, and circuit performance and reliability parameters. The use of this approach is illustrated using the design and optimization of IGBTs in resonant power converter applications.<>

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Proceedings of 1994 IEEE Workshop on Computers in Power Electronics

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