用数值工具评价微带天线分析

Proceedings of the 1998 South African Symposium on Communications and Signal Processing-COMSIG '98 (Cat. No. 98EX214) Pub Date : 1998-09-07 DOI:10.1109/COMSIG.1998.736995

D. Pansegrouw, K. Palmer

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引用次数: 2

摘要

对4微带贴片天线的几种商用CAD封装分析方法进行了比较研究。将预测结果与测量结果进行了比较，并对计算机运行时间进行了比较。介绍了三种测量衬底介电常数的方法。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Evaluation of microstrip antenna analysis using numerical tools

A comparative study is presented of a number of commercial CAD package analyses of 4 microstrip patch antennas. Predicted results are compared to measurements, and comparisons of computer run-time are presented. Three techniques to measure the dielectric constant of substrates are also presented.

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来源期刊

Proceedings of the 1998 South African Symposium on Communications and Signal Processing-COMSIG '98 (Cat. No. 98EX214)

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