{"title":"晶圆级跟踪和控制全迷你环境线","authors":"K. Uriga, B. Crandell","doi":"10.1109/ISSM.2001.962912","DOIUrl":null,"url":null,"abstract":"This paper addresses wafer level tracking as the key technology to achieve higher productivity in a full mini-environmentalized (M-E) manufacturing line. Texas Instruments has developed and installed the M-E and wafer level tracking control system for the new 8 inch line in Dallas and transferred the same concept to new 8 inch lines in other fabs. The wafer level tracking (WLT) system established the following: elimination of 100% of wafer scraps caused by mishandling by manufacturing technician; retention of the same working productivity in the M-E line as in legacy lines using open cassettes; provision of tracking data for wafer level fault detection. The approach, issues and achievements are discussed in this paper.","PeriodicalId":356225,"journal":{"name":"2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)","volume":"93 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Wafer level tracking and control to full mini-environment line\",\"authors\":\"K. Uriga, B. Crandell\",\"doi\":\"10.1109/ISSM.2001.962912\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper addresses wafer level tracking as the key technology to achieve higher productivity in a full mini-environmentalized (M-E) manufacturing line. Texas Instruments has developed and installed the M-E and wafer level tracking control system for the new 8 inch line in Dallas and transferred the same concept to new 8 inch lines in other fabs. The wafer level tracking (WLT) system established the following: elimination of 100% of wafer scraps caused by mishandling by manufacturing technician; retention of the same working productivity in the M-E line as in legacy lines using open cassettes; provision of tracking data for wafer level fault detection. The approach, issues and achievements are discussed in this paper.\",\"PeriodicalId\":356225,\"journal\":{\"name\":\"2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)\",\"volume\":\"93 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-10-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSM.2001.962912\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSM.2001.962912","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Wafer level tracking and control to full mini-environment line
This paper addresses wafer level tracking as the key technology to achieve higher productivity in a full mini-environmentalized (M-E) manufacturing line. Texas Instruments has developed and installed the M-E and wafer level tracking control system for the new 8 inch line in Dallas and transferred the same concept to new 8 inch lines in other fabs. The wafer level tracking (WLT) system established the following: elimination of 100% of wafer scraps caused by mishandling by manufacturing technician; retention of the same working productivity in the M-E line as in legacy lines using open cassettes; provision of tracking data for wafer level fault detection. The approach, issues and achievements are discussed in this paper.