晶圆级跟踪和控制全迷你环境线

K. Uriga, B. Crandell
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引用次数: 0

摘要

本文将晶圆级跟踪作为在全微环境(M-E)生产线中实现更高生产率的关键技术。德州仪器已经为达拉斯的新8英寸生产线开发并安装了M-E和晶圆级跟踪控制系统,并将相同的概念转移到其他工厂的新8英寸生产线上。晶圆级跟踪(WLT)系统建立了以下几点:100%消除由制造技术人员不当操作造成的晶圆废料;在M-E生产线中保留与使用开放式磁带的传统生产线相同的工作生产率;为晶圆级故障检测提供跟踪数据。本文讨论了该方法、存在的问题和取得的成果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Wafer level tracking and control to full mini-environment line
This paper addresses wafer level tracking as the key technology to achieve higher productivity in a full mini-environmentalized (M-E) manufacturing line. Texas Instruments has developed and installed the M-E and wafer level tracking control system for the new 8 inch line in Dallas and transferred the same concept to new 8 inch lines in other fabs. The wafer level tracking (WLT) system established the following: elimination of 100% of wafer scraps caused by mishandling by manufacturing technician; retention of the same working productivity in the M-E line as in legacy lines using open cassettes; provision of tracking data for wafer level fault detection. The approach, issues and achievements are discussed in this paper.
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