高性能高k/金属栅极Ge pmosfet,栅极长度低至125 nm,晕形植入

B. de Jaeger, G. Nicholas, D.P. Borneo, G. Eneman, M. Meuris, M. Heyns
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引用次数: 16

摘要

栅极长度低至125 nm的Ge pmosfet是在类似si的工艺流程中制造的。增加一个光环植入物可将VT滚降从207 mV降低到36 mV,并将DIBL从230 mV/V降低到54 mV/V。当VDD = -1.5 V时,电压为8.8 nA/mum,从源处评估时,离子达到770 muA/mum。基准测试表明,这些Ge pmosfet具有超越其(应变)Si对应物的潜力。100摄氏度的测量表明,Ge在实际的逻辑工作温度下仍将具有竞争力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High Performance High-k/Metal Gate Ge pMOSFETs with gate lengths down to 125 nm and halo implant
Ge pMOSFETs with gate lengths down to 125 nm are fabricated in a Si-like process flow. The addition of a halo implant reduces VT roll-off from 207 mV to 36 mV, and DIBL from 230 mV/V to 54 mV/V. Ion of 770 muA/mum is attained for Ioff of 8.8 nA/mum at VDD = -1.5 V, when evaluating from the source. Benchmarking shows these Ge pMOSFETs have the potential to outperform their (strained) Si counterparts. Measurements at 100degC suggest that Ge will continue to be competitive at realistic logic operating temperatures.
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