集成电路设计中片上互连的前瞻性电流模式方法

Yash Agrawal, R. Chandel, Mekala Girish Kumar, R. Parekh
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引用次数: 0

摘要

在当今复杂的纳米时代和小型化密集集成电路(IC)设计中,片上互连已成为决定超大规模集成电路(VLSI)系统整体性能的主要控制因素之一。为了追求高性能,满足半导体VLSI行业不断增长的需求,并在计算有限的硅片面积上推动集成应用,寻找新的潜力和前景的设计技术一直是许多研究人员优先考虑和严格探索的问题。片上互连的电流模式方法是一种适合于高端集成电路设计的信号方案和有效的性能改进技术。准确的片上互连分析模型的制定以及前瞻性的电流模式信号(CMS)方案和评估其性能是至关重要的问题。在本章中,明确表达了片上互连的各种性能指标。研究了采用传统电压和先进电流两种不同信号方式的互连性能。考虑的各种性能指标包括互连线上的电压摆动、延迟、功耗、能耗和带宽。研究发现,与CMS方案相比,电压模式信号(VMS)的功耗和能耗分别降低了近8.6%和9.2%。CMS方案的时延比VMS方案低53%,带宽比VMS方案高161%。分析了互连长度和脉冲周期变化对采用VMS和CMS方案的互连性能参数的影响。利用SPICE仿真EDA工具对所提出的分析模型结果进行了验证,实现了较高的精度。目前的工作着重于先进的电流模式方法,并因此分析了不同的信号方案在集成电路中高性能片上VLSI互连的有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Prospective current mode approach for on-chip interconnects in integrated circuit designs
In today's sophisticated nanoera and miniaturised densely packed integrated circuit (IC) designs, on-chip interconnects have become one of the dominant governing factors in determining the overall performance of very large scale integration (VLSI) system. In pursuit to attain high performance, to quench the thirst of continuously increasing demands of semiconductor VLSI industry and to boost up the integrated applications on the calculated limited silicon chip area, hunt for new potential and prospective design techniques have always been on priority and rigorously explored by several researchers. Current mode approach for on-chip interconnects is one of the aptly suited signalling schemes and effective performance improvement techniques for high-end IC designs. An accurate analytical model formulation of on-chip interconnects together with prospective current mode signalling (CMS) scheme and evaluating their performance are crucial and important issue. In this chapter, explicit expressions of various performance metrics for on-chip interconnects are formulated. The performance of interconnects using two varying signalling schemes namely conventional voltage and advanced current mode is investigated. The various performance metrics considered are voltage swing over interconnect line, delay, power dissipation, energy dissipation and bandwidth. It is found that voltage mode signalling (VMS) has advantage of reduced power and energy dissipation of nearly 8.6% and 9.2%, respectively, as compared to CMS scheme. It is also investigated that CMS has about 53% lesser delay and 161% higher bandwidth than VMS scheme. The effect of interconnect length and pulse period variations on the performance parameters of the interconnect using VMS and CMS schemes are also analysed. The proposed analytical model results are validated using SPICE simulation EDA tool and high level of accuracy has been realised. The present work keenly focuses on advanced current mode approach and henceforth analysing the effectiveness of different signalling schemes for high performance on-chip VLSI interconnects in ICs.
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