无功阻抗基板上增强型贴片阵列的设计

V. Jaeck, L. Bernard
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引用次数: 3

摘要

设计了频率为2.3GHz的无功阻抗衬底(RIS)。首次将其与单个贴片天线相关联,将其性能与打印在相同材料上的常规贴片(没有元材料晶格)以及先前使用RIS的结果进行比较;实现了显著的带宽增强。第二次,RIS与四个贴片的线性阵列相关联,并且像以前一样,将性能与没有超材料晶格的相同结构的性能进行比较。制作并测量了该阵列的原型,显示出增强的带宽;与数值计算结果吻合较好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design of an enhanced patch array on a Reactive Impedance Substrate
A Reactive Impedance Substrate (RIS) is designed at the frequency of 2.3GHz. Associated in a first time to a single patch antenna, the performances are compared to a regular patch (without meta-material lattice) printed on the same materials, as well as to previous results with RIS; a significant bandwidth enhancement is achieved. In a second time, the RIS is associated to a linear array of four patches, and as previously the performances are compared to the ones of the same structure without the meta-material lattice. A prototype of the array is fabricated and measured, exhibiting an enhanced bandwidth; a good agreement is found with the numerical results.
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