56Gbps跨背板传输信道的仿真与设计

Kai Yao, Qiang Wu, Jinling Cui
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摘要

近十年来,人工智能、云服务、大数据等新技术和新应用推动互联设备和数据流量呈指数级增长。这对数据传输的带宽和稳定性提出了更高的要求。为了达到器件集成化和小型化的目的,通常采用背板结构来实现板卡系统之间的互连。背板作为数据交换的基础。然而,跨背板的长距离传输会造成严重的损耗和各种信号完整性问题。近年来,随着串行传输技术的发展,56Gbps PAM4调制传输逐渐显示出超过28Gbps NRZ的传输效率。调制方式的改变带来9.5dB的固有损耗,PAM4调制对信号完整性的要求更为严格。本文利用ADS对跨背板远距离传输信道进行建模和仿真,从板、层和孔三个方面建立了一套基于OIF CSI-56G-LR规范的高速传输信道设计方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Simulation and Design of a 56Gbps Cross-backplane Transmission Channel
Over the past decade, new technologies and applications such as artificial intelligence, cloud services, and big data have led to an exponential increase in Internet-connected devices and data traffic. This puts forward higher requirements for bandwidth and stability of data transmission. In order to achieve the goal of device integration and miniaturization, the backplane structure is often used to realize the interconnect between board and card systems. The backplane is used as the basis for data exchange. However, the long-distance transmission across the backplane will cause serious losses and various signal integrity problems. In recent years, with the development of serial transmission, 56Gbps PAM4 modulation transmission has gradually shown transmission efficiency beyond 28Gbps NRZ. The change of modulation mode brings an inherent loss of 9.5dB, and PAM4 modulation has more stringent requirements on signal integrity. In this paper, ADS is used to model and simulate the cross-backplane long-distance transmission channel, and a set of high-speed transmission channel design scheme based on OIF CSI-56G-LR specification is established from the aspects of plate, laminates and holes.
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