模拟设计挑战和权衡使用新兴材料和设备

M. Fulde, A. Mercha, C. Gustin, B. Parvais, V. Subramanian, K. von Arnim, F. Bauer, K. Schruefer, D. Schmitt-Landsiede, G. Knoblinger
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引用次数: 11

摘要

随着先进材料和器件(如高k值或多栅极场效应管)的引入,模拟器件的性能值发生了显著变化。测量显示增强的固有增益和匹配行为的mugfet,这有助于减少模拟电路的面积和功耗。然而,高k会降低匹配、闪烁噪声和Vt稳定性。测量的器件性能用于模拟这些趋势对电路设计权衡的影响。从SiON到HfO2介电介质的迁移大约使面积和功耗加倍,以保持匹配和噪声性能不变。10mv范围内的瞬态VT不稳定性会使模数转换器的分辨率降低1位以上。建议使用非二进制adc来克服这些问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analog design challenges and trade-offs using emerging materials and devices
Analog device figures-of-merit change significantly with the introduction of advanced materials and devices such as high-k or multiple-gate FETs. Measurements show enhanced intrinsic gain and matching behavior for MuGFETs which help to reduce area and power consumption in analog circuits. However, high-k degrades matching, flicker noise and Vt stability. Measured device performance is used to simulate the impact of these trends on circuit design trade-offs. Migrating from SiON to HfO2 dielectric approximately doubles area and power consumption to keep matching and noise performance constant. Transient VT instabilities in the range of 10 mV can degrade the resolution of analog-to-digital converters by more than one bit. The use of non-binary ADCs is proposed to overcome these issues.
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