具有4 μm模场直径的热膨胀芯光纤，适合与硅光子器件的低损耗耦合

2017 Optical Fiber Communications Conference and Exhibition (OFC) Pub Date : 2017-03-19 DOI:10.1364/OFC.2017.TU3K.5

T. Oda, K. Hirakawa, K. Ichii, S. Yamamoto, K. Aikawa

{"title":"具有4 μm模场直径的热膨胀芯光纤，适合与硅光子器件的低损耗耦合","authors":"T. Oda, K. Hirakawa, K. Ichii, S. Yamamoto, K. Aikawa","doi":"10.1364/OFC.2017.TU3K.5","DOIUrl":null,"url":null,"abstract":"We developed thermally expanded core fibers with a 4-μm mode field diameter. The connection loss with conventional single-mode fibers is below 0.2 dB. The coupling loss with silicon devices can be below 1.5 dB/facet.","PeriodicalId":242238,"journal":{"name":"2017 Optical Fiber Communications Conference and Exhibition (OFC)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Thermally expanded core fiber with a 4-μm mode field diameter suitable for low-loss coupling with silicon photonic devices\",\"authors\":\"T. Oda, K. Hirakawa, K. Ichii, S. Yamamoto, K. Aikawa\",\"doi\":\"10.1364/OFC.2017.TU3K.5\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We developed thermally expanded core fibers with a 4-μm mode field diameter. The connection loss with conventional single-mode fibers is below 0.2 dB. The coupling loss with silicon devices can be below 1.5 dB/facet.\",\"PeriodicalId\":242238,\"journal\":{\"name\":\"2017 Optical Fiber Communications Conference and Exhibition (OFC)\",\"volume\":\"26 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-03-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 Optical Fiber Communications Conference and Exhibition (OFC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1364/OFC.2017.TU3K.5\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 Optical Fiber Communications Conference and Exhibition (OFC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1364/OFC.2017.TU3K.5","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 4

摘要

我们开发了4 μm模场直径的热膨胀芯纤维。与传统单模光纤的连接损耗在0.2 dB以下。与硅器件的耦合损耗可低于1.5 dB/facet。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Thermally expanded core fiber with a 4-μm mode field diameter suitable for low-loss coupling with silicon photonic devices

We developed thermally expanded core fibers with a 4-μm mode field diameter. The connection loss with conventional single-mode fibers is below 0.2 dB. The coupling loss with silicon devices can be below 1.5 dB/facet.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2017 Optical Fiber Communications Conference and Exhibition (OFC)

自引率

0.00%

发文量