柔性聚合物基板的8V有机互补逻辑工艺

H. Klauk, M. Halik, U. Zschieschang, F. Eder, G. Schmid, C. Dehm
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引用次数: 1

摘要

我们在柔性衬底上设计并制造了第一个有机互补集成电路。以五苯和十六氟酞菁(F/sub 16/CuPc)为p型和n型有机半导体,以溶液处理的聚乙烯酚为栅极电介质。晶体管和电路在低至8 V的电源电压下工作,环形振荡器每级的信号传播延迟低至8 /spl mu/sec。据我们所知,这些是迄今为止报道的最快的有机互补电路。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An 8V organic complementary logic process for flexible polymeric substrates
We have designed and fabricated the first organic complementary integrated circuits on a flexible substrate. Pentacene and hexadecafluorocopperphthalocyanine (F/sub 16/CuPc) were used as the p-type and n-type organic semiconductors, and solution-processed polyvinylphenol was used as the gate dielectric. Transistors and circuits operate with a supply voltage as low as 8 V, and ring oscillators have a signal propagation delay as low as 8 /spl mu/sec per stage. To our knowledge, these are the fastest organic complementary circuits reported to date.
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