大功率薄膜电容器的高频性能及封装

IAS '95. Conference Record of the 1995 IEEE Industry Applications Conference Thirtieth IAS Annual Meeting Pub Date : 1995-10-08 DOI:10.1109/IAS.1995.530624

J. Bentley, M. Hudis, R. Kerrigan, F. Macdougall

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引用次数: 2

摘要

本文讨论了专为降低串联电感和提高电力电子应用所需的脉冲处理能力而设计的干金属化聚丙烯薄膜电容器的引线端子。本文还讨论了与测试用于电力电子应用的聚合物薄膜电容器有关的问题;特别是高频测试，由于高电压上升速度波形而加速老化，以及由于焊接，清洗和封装或灌封等电子组装加工而产生的热冲击。

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High frequency performance and packaging of power film capacitors

This paper discusses lead terminations for dry metallized polypropylene film capacitors designed specifically for the purpose of lowering the series inductance and increasing the pulse handling performance capability required for power electronic applications. This paper also discusses issues associated with testing polymer film capacitors for power electronic applications; specifically high frequency testing, accelerated aging due to high voltage rate-of-rise wave shapes and thermal shock due to electronic assembly processing such as soldering, cleaning and encapsulating or potting.

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IAS '95. Conference Record of the 1995 IEEE Industry Applications Conference Thirtieth IAS Annual Meeting

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