毫米波微带集成电路收发器封装

M. Gawronski, J. Lamberg, D. Singh
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引用次数: 2

摘要

毫米波混合集成电路的发展已经取得了相当大的进展。在低成本和大批量生产是关键因素的程序应用中,平面微带技术是首选的方法。讨论了三种工作频率为35ghz、60ghz和94ghz的全集成微带FMCW收发器的设计和封装,并讨论了毫米波微带系统的独特低成本、低质量封装方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Millimeter-wave microstrip integrated circuit transceiver packaging
There has been considerable progress 1n the development of millimeter-wave hybrid integrated circuits. In program applications where low-cost and high-volume producibility are the key factors, planar microstrip technology 1s the preferred approach. The design and packaging of three fully integrated microstrip FMCW transceivers operating at 35, 60, and 94 GHz are discussed, plus a discussion on a unique low-cost, low-mass packaging approach for millimeter-wave microstrip based systems.
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