三维CMOS-NEM FPGA结构与性能评价

Chen Dong, Chen Chen, S. Mitra, Deming Chen
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引用次数: 17

摘要

在本文中,我们介绍了一种可重构的结构,称为3D CMOS-NEM FPGA,它协同利用了纳米机电(NEM)继电器和3D集成技术。我们架构的独特功能包括:混合CMOS-NEM FPGA查找表(lut)和可配置逻辑块(clb),基于nem的开关块(SBs)和连接块(CBs),以及面对面的3D堆叠。该体系结构还具有名为direct link的内置功能,该功能是使用两个堆栈之间的短垂直线的专用本地通信通道,以进一步提高性能。开发了定制的3D FPGA布局和路由流程。通过用NEM继电器取代CMOS元件,与基准2D CMOS架构相比,可以实现19.5%的延迟降低。3D叠加与NEM器件在基线上实现了31.5%的延迟降低。该体系结构的最佳性能是通过添加直接链接实现的,它提供了比基线高41.9%的性能增益。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Architecture and performance evaluation of 3D CMOS-NEM FPGA
In this paper, we introduce a reconfigurable architecture, named 3D CMOS-NEM FPGA, which utilizes Nanoelectromechanical (NEM) relays and 3D integration techniques synergistically. Unique features of our architecture include: hybrid CMOS-NEM FPGA look-up tables (LUTs) and configurable logic blocks (CLBs), NEM-based switch blocks (SBs) and connection blocks (CBs), and face-to-face 3D stacking. This architecture also has a built-in feature named direct link which is dedicated local communication channel using the short vertical wire between the two stacks to further enhance performance. A customized 3D FPGA placement and routing flow has been developed. By replacing CMOS components with NEM relays, a 19.5% delay reduction can be achieved compared to the baseline 2D CMOS architecture. 3D stacking together with NEM devices achieves a 31.5% delay reduction over the baseline. The best performance of this architecture is achieved by adding direct links, which provides a 41.9% performance gain over the baseline.
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