{"title":"ku波段射频多功能芯片","authors":"Madhumita Chakravarti, K. Reddy, V. Kirty","doi":"10.1109/IMARC.2015.7411409","DOIUrl":null,"url":null,"abstract":"RF Multi-function chip (MFC) design is taken up to reduce number of connectors, interconnecting cables and RF devices that cause isolation and RF-matching problem causing un-reliability of the system. The repeatability of the performance of RF module is important for production of a system. Power coupler, mixer and preamplifier stages are designed in one chip. LNA, mixer and power dividers are designed in the second chip. The simulation and fabrication results show a close match.","PeriodicalId":307742,"journal":{"name":"2015 IEEE MTT-S International Microwave and RF Conference (IMaRC)","volume":"39 12","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"RF multi-function chip at Ku-band\",\"authors\":\"Madhumita Chakravarti, K. Reddy, V. Kirty\",\"doi\":\"10.1109/IMARC.2015.7411409\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"RF Multi-function chip (MFC) design is taken up to reduce number of connectors, interconnecting cables and RF devices that cause isolation and RF-matching problem causing un-reliability of the system. The repeatability of the performance of RF module is important for production of a system. Power coupler, mixer and preamplifier stages are designed in one chip. LNA, mixer and power dividers are designed in the second chip. The simulation and fabrication results show a close match.\",\"PeriodicalId\":307742,\"journal\":{\"name\":\"2015 IEEE MTT-S International Microwave and RF Conference (IMaRC)\",\"volume\":\"39 12\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE MTT-S International Microwave and RF Conference (IMaRC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMARC.2015.7411409\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE MTT-S International Microwave and RF Conference (IMaRC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMARC.2015.7411409","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
RF Multi-function chip (MFC) design is taken up to reduce number of connectors, interconnecting cables and RF devices that cause isolation and RF-matching problem causing un-reliability of the system. The repeatability of the performance of RF module is important for production of a system. Power coupler, mixer and preamplifier stages are designed in one chip. LNA, mixer and power dividers are designed in the second chip. The simulation and fabrication results show a close match.
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