防止簇状缺陷的金属前清洁优化

2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203) Pub Date : 2001-10-08 DOI:10.1109/ISSM.2001.963024

S. Y. Ku, T. Lo, Y. Shih, C. Shi, C.H. Wang, Y.J. Yu

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引用次数: 0

摘要

金属前清洗是水化工艺中金属循环前的关键工序。表面缺陷，如表面天然氧化物或任何其他污染，可能导致Ti/TiN的粘附性差，从而形成较差的水化物。用IPA干法处理HF是一种广泛使用的表面缺陷去除方法，其结果是表面清洁，无水斑，化学氧化物较少。然而，一个簇型缺陷是伴随这种处理在水利化过程。本工作的目的是为大规模生产提供一种优化的金属前清洁程序。

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Pre-metal clean optimization for cluster defect prevention

Pre-metal clean is a critical procedure before the metal loop in the salicide process. Surface defects such as the surface native oxide or any other contamination may result in a poor adhesion of Ti/TiN, for example, and hence the poor salicide formation. HF treatment with IPA dry is a widely used methodology for surface defect removal, and results in a clean surface which is water spot free and has less chemical oxide. However, a cluster type defect is an accompaniment of this treatment in the salicide process. The aim of this work is to provide an optimized cleaning procedure at pre-metal clean for mass production.

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2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)

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