偶联剂对BN/间位芳纶复合纸电性能的影响

Hao-ou Ruan, Qing Xie, Jingxuan Song, Fanacheng Lü
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引用次数: 0

摘要

偶联剂是影响BN/间位芳纶纸电性能的关键因素。研究了巯基-丙基(MP)、甘油三酯-丙基(GP)、氨基-丙基(AP)和三氟辛基(TFO)等不同亲有机基团的三乙氧基-硅烷偶联剂。比较了改性纸的结构和电学性能,并进行了分子模拟,揭示了改性BN与芳纶的界面相互作用。结果表明,AP和TFO对复合纸绝缘性能的增强效果优于GP和MP。选择TFO和15 wt%填料时,纸的最佳击穿强度为28.17 kV /mm,是羟基化BN/芳纶纸的1.8倍。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effect of coupling agents on the electrical performance of BN/ meta-aramid composite paper
Coupling agents can be key for the electrical performance of BN/ meta-aramid paper. In this article, triethoxy-silane coupling agents with different organophilic groups, including mercapto-propyl (MP), glycidylether-propyl (GP), amino-propyl (AP) and trideca-fluoro-octyl (TFO) were studied. The structural and electrical properties of modified papers were compared, and the molecular simulation was conducted to reveal the interface interaction of modified BN and aramid. The results show that AP and TFO have a better enhancing effect of insulation performance of composite paper than GP and MP. By choosing TFO and 15 wt% filler content, the optimal breakdown strength of paper was obtained as 28.17 kV /mm, 1.8 times that of the hydroxylated BN/ aramid paper.
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