影响MEMS真空封装材料放气速率的因素分析

Yong Yang, Bin Zhou, X. Dai, Yun Huang
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引用次数: 0

摘要

利用有限元软件Comsol Multiphysics分析了真空封装过程中材料表面的热解吸和真空的破坏。本研究选取表面初始吸附分子浓度、温度和表面粗糙度三个影响因素,研究真空包装中的真空降解。三水平三因素的正交试验分析表明,封装材料的表面吸附初始值、温度、表面粗糙度对封装放气性能的影响如下:初始吸附>的表面粗糙度>的温度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analysis of factors affecting the outgassing rate of MEMS vacuum packaging materials
The finite element Comsol Multiphysics software was used to analyze the thermal desorption on the surface of the material in vacuum packaging, and the destruction of the vacuum. In this study, three influencing factors, the concentration of initial adsorbed molecules on the surface, temperature and surface roughness, are selected to study the vacuum degradation in vacuum packaging. The orthogonal test analysis of three levels and three factors shows that the initial value of the surface adsorption of the packaging material, temperature, and surface roughness affect the outgassing performance of the package as follows: the value of the initial adsorption> surface roughness> temperature.
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