{"title":"基板集成波导技术中的折叠y结","authors":"Cheng Zhao, C. Fumeaux, C. Lim","doi":"10.1109/AUSMS.2016.7593473","DOIUrl":null,"url":null,"abstract":"This paper presents a novel Y-junction in folded substrate-integrated waveguide technology. The structure is analyzed with finite-element method using Ansys HFSS, and the simulation results show that the reflection coefficients of the 120° branch ports for the folded substrate-integrated waveguide Y-junction can satisfy the constraints for optimum performance of diplexers. In comparison with an unfolded substrate-integrated waveguide Y-junction, the characteristics of the presented structure can meet the constraints in a wider frequency band, which means that the flexibility for the selection of the up and down channel bands is increased.","PeriodicalId":103180,"journal":{"name":"2016 IEEE 2nd Australian Microwave Symposium (AMS)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Folded Y-junction in substrate-integrated waveguide technology\",\"authors\":\"Cheng Zhao, C. Fumeaux, C. Lim\",\"doi\":\"10.1109/AUSMS.2016.7593473\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a novel Y-junction in folded substrate-integrated waveguide technology. The structure is analyzed with finite-element method using Ansys HFSS, and the simulation results show that the reflection coefficients of the 120° branch ports for the folded substrate-integrated waveguide Y-junction can satisfy the constraints for optimum performance of diplexers. In comparison with an unfolded substrate-integrated waveguide Y-junction, the characteristics of the presented structure can meet the constraints in a wider frequency band, which means that the flexibility for the selection of the up and down channel bands is increased.\",\"PeriodicalId\":103180,\"journal\":{\"name\":\"2016 IEEE 2nd Australian Microwave Symposium (AMS)\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-02-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE 2nd Australian Microwave Symposium (AMS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/AUSMS.2016.7593473\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 2nd Australian Microwave Symposium (AMS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/AUSMS.2016.7593473","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Folded Y-junction in substrate-integrated waveguide technology
This paper presents a novel Y-junction in folded substrate-integrated waveguide technology. The structure is analyzed with finite-element method using Ansys HFSS, and the simulation results show that the reflection coefficients of the 120° branch ports for the folded substrate-integrated waveguide Y-junction can satisfy the constraints for optimum performance of diplexers. In comparison with an unfolded substrate-integrated waveguide Y-junction, the characteristics of the presented structure can meet the constraints in a wider frequency band, which means that the flexibility for the selection of the up and down channel bands is increased.
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