一种新的、简单的直流方法提取缩放FinFET器件的热阻

2018 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) Pub Date : 1900-01-01 DOI:10.1109/VLSI-TSA.2018.8403832

Wei-Cheng Huang, P. Su

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引用次数: 0

摘要

本文提出了一种新的、简单的热卡盘测量方法，用于提取finfet的热阻。固有的跨导消除了寄生源漏电阻效应，可以作为温度传感器来表征由于自热引起的器件温升。我们的方法只需要直流测量，不需要特殊的测试结构。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A new and simple DC method for thermal-resistance extraction of scaled FinFET devices

This work proposes a new and simple hot-chuck measurement method for the extraction of the thermal resistance of FinFETs. The intrinsic transconductance that eliminates the parasitic source/drain resistance effect can serve as a temperature sensor to characterize the device temperature rise due to self-heating. Our method requires only DC measurements without the need of special test structures.

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2018 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)

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