内建可靠性:软错误——一个案例研究

Z. Hasnain, A. Ditali
{"title":"内建可靠性:软错误——一个案例研究","authors":"Z. Hasnain, A. Ditali","doi":"10.1109/RELPHY.1992.187657","DOIUrl":null,"url":null,"abstract":"A case is described for implementing building-in reliability. The case study deals with the phenomenon of soft-error rates in DRAMs. It is shown that the process begins with looking at output variables and then working backwards to identify the key input variables that affect the output variables. The authors demonstrate how monitoring the identified input variables leads to a stable process in manufacturing. In addition, they have identified a new source of alpha particles that contributes to the soft error rate of memory ICs, namely, the phosphoric acid used during wafer fabrication. The findings show that the raw materials used in wafer fabrication are at least as great a source of alpha particle emissivity as are packaging materials.<<ETX>>","PeriodicalId":154383,"journal":{"name":"30th Annual Proceedings Reliability Physics 1992","volume":"10 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"22","resultStr":"{\"title\":\"Building-in reliability: soft errors-a case study\",\"authors\":\"Z. Hasnain, A. Ditali\",\"doi\":\"10.1109/RELPHY.1992.187657\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A case is described for implementing building-in reliability. The case study deals with the phenomenon of soft-error rates in DRAMs. It is shown that the process begins with looking at output variables and then working backwards to identify the key input variables that affect the output variables. The authors demonstrate how monitoring the identified input variables leads to a stable process in manufacturing. In addition, they have identified a new source of alpha particles that contributes to the soft error rate of memory ICs, namely, the phosphoric acid used during wafer fabrication. The findings show that the raw materials used in wafer fabrication are at least as great a source of alpha particle emissivity as are packaging materials.<<ETX>>\",\"PeriodicalId\":154383,\"journal\":{\"name\":\"30th Annual Proceedings Reliability Physics 1992\",\"volume\":\"10 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"22\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"30th Annual Proceedings Reliability Physics 1992\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RELPHY.1992.187657\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"30th Annual Proceedings Reliability Physics 1992","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.1992.187657","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 22

摘要

介绍了一个实现内建可靠性的实例。本案例研究处理dram中的软错误率现象。它显示了该过程从查看输出变量开始,然后向后工作以确定影响输出变量的关键输入变量。作者演示了如何监测识别的输入变量导致一个稳定的过程在制造。此外,他们还发现了导致内存ic软错误率的α粒子的新来源,即在晶圆制造过程中使用的磷酸。研究结果表明,晶圆制造中使用的原材料至少与包装材料一样是α粒子发射率的重要来源。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Building-in reliability: soft errors-a case study
A case is described for implementing building-in reliability. The case study deals with the phenomenon of soft-error rates in DRAMs. It is shown that the process begins with looking at output variables and then working backwards to identify the key input variables that affect the output variables. The authors demonstrate how monitoring the identified input variables leads to a stable process in manufacturing. In addition, they have identified a new source of alpha particles that contributes to the soft error rate of memory ICs, namely, the phosphoric acid used during wafer fabrication. The findings show that the raw materials used in wafer fabrication are at least as great a source of alpha particle emissivity as are packaging materials.<>
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信