表面贴装焊料在热循环过程中的晶界滑动

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI:10.1109/ECTC.1990.122233

S. Lee, D. Stone

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引用次数: 15

摘要

本文报道了近共晶表面贴装焊点在循环热位移控制加载过程中疲劳裂纹的扩展。陶瓷无引线芯片载体(LLCC)承受的热疲劳频率为1/小时，温度范围为-36℃至125℃和-20℃至75℃。使用扫描电子显微镜检查焊点的表面和横截面。在热循环过程中，单个颗粒(片状和球状的菌落)会相对滑动。滑动导致表面产生疲劳裂纹。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Grain boundary sliding in surface mount solders during thermal cycling

The growth of fatigue cracks in near-eutectic, surface-mount solder joints during cyclic, thermal displacement-controlled loading is reported. Ceramic leadless chip carriers (LLCC) are subjected to thermal fatigue with a frequency of 1/hr and over two ranges of temperature: -36 degrees C to 125 degrees C and -20 degrees C to 75 degrees C. Surfaces and cross-sections of the solder joints are inspected using scanning electron microscopy. Individual grains (colonies of lamellae and globulae) are found to slide relative to one another during thermal cycling. Sliding causes fatigue cracks to initiate at the surface.<>

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来源期刊

40th Conference Proceedings on Electronic Components and Technology

CiteScore

3.10

自引率

0.00%

发文量