陶瓷镀铜新工艺的性能和可靠性

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI:10.1109/ECTC.1990.122324

J. Fudala, M. Beke

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引用次数: 0

摘要

描述了一种陶瓷镀铜技术，其特征为陶瓷PC(印刷电路板)板。用剥离试验方法评价了镀铜在96%氧化铝、99.5%氧化铝、氧化铍和硝酸铝上的附着力。镀铜技术在性能和可靠性方面超越了以前的镀铜工艺

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The performance and reliability of a new plated copper technology on ceramic

A plated copper-on-ceramic technology that can be characterized as a ceramic PC (printed circuit) board is described. Adhesion of the plated copper on 96% alumina, 99.5% alumina, beryllium oxide, and aluminum nitrate was evaluated using a peel test method. The plated copper technology is shown to surpass previous plated copper processes in performance and reliability.<>

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来源期刊

40th Conference Proceedings on Electronic Components and Technology

CiteScore

3.10

自引率

0.00%

发文量