{"title":"大规模集成电路晶圆制造设备管理方法","authors":"T. Tsuyama, T. Harada, J. Nakazato, K. Kubouchi","doi":"10.1109/ARMS.1989.49597","DOIUrl":null,"url":null,"abstract":"A method is described for analyzing factors causing variations in manufacturing facilities in which monitored data that correlate with product quality are collected during routine operation. By using a method of accumulating deviations from the center value of the monitored data and quality data in time sequence, the fluctuation point can be detected, the correlation checked, and the cause of the variation discovered.<<ETX>>","PeriodicalId":430861,"journal":{"name":"Proceedings., Annual Reliability and Maintainability Symposium","volume":"348 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1989-01-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Management method for LSI wafer fabrication facilities\",\"authors\":\"T. Tsuyama, T. Harada, J. Nakazato, K. Kubouchi\",\"doi\":\"10.1109/ARMS.1989.49597\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A method is described for analyzing factors causing variations in manufacturing facilities in which monitored data that correlate with product quality are collected during routine operation. By using a method of accumulating deviations from the center value of the monitored data and quality data in time sequence, the fluctuation point can be detected, the correlation checked, and the cause of the variation discovered.<<ETX>>\",\"PeriodicalId\":430861,\"journal\":{\"name\":\"Proceedings., Annual Reliability and Maintainability Symposium\",\"volume\":\"348 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1989-01-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings., Annual Reliability and Maintainability Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ARMS.1989.49597\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings., Annual Reliability and Maintainability Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ARMS.1989.49597","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Management method for LSI wafer fabrication facilities
A method is described for analyzing factors causing variations in manufacturing facilities in which monitored data that correlate with product quality are collected during routine operation. By using a method of accumulating deviations from the center value of the monitored data and quality data in time sequence, the fluctuation point can be detected, the correlation checked, and the cause of the variation discovered.<>
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